Remanufactured AMAT Mirra and Reflexion CMP Equipment

Entrepix refurbishes your existing AMAT Mirra and Reflexion CMP equipment.

AMAT Mirra 3400 Standalone, Mirra Trak, and Mirra Mesa CMP Wafer Polishers

Specs and capabilities:

Automated system uses combination of chemistry and abrasion to remove specific amounts of material from wafer surfaces
Industry-leading 200mm CMP on all polishing applications
Dry-in and dry-out wafer processing (Trak and Mesa systems only)
Integrated OnTrak DSS Integra scrubber (Trak system only)
FABS unit can accommodate up to four 25-wafer cassettes
Polishing head optimizes uniformity across wafer by fine-tuning film removal rate to match specific slurry chemistries to control dishing and erosion

Specs and capabilities:

Automated system uses combination of chemistry and abrasion to remove specific amounts of material from wafer surfaces
Industry-leading 300mm CMP on all polishing applications
Can accommodate up to three load ports
Contour polishing head optimizes uniformity across wafer
Five independent pressure zones deliver unmatched within-wafer uniformity and edge control
Production-proven, high performance planarization for copper damascene, shallow trench isolation (STI), oxide, polysilicon, and tungsten applications
High-speed planarizing platens and multi-zone polishing for superior uniformity and efficiency
Low downforce for extendibility to < 45nm device generations
Integrated post-CMP Desica cleaner
Full-immersion Marangoni vapor drying technology virtually eliminates watermark defects and dramatically reduces particle contamination
Full suite of end-point methods, in-line metrology, and advanced process control capabilities
Excellent within-wafer and wafer-to-wafer process control and repeatability