Remanufactured AMAT Mirra and Reflexion® CMP Equipment

Entrepix refurbishes your existing AMAT Mirra and Reflexion® CMP equipment.

AMAT Mirra 3400 Standalone, Mirra Trak, and Mirra Mesa CMP Wafer Polishers

Specs and capabilities:

Automated system uses combination of chemistry and abrasion to remove specific amounts of material from wafer surfaces
Industry-leading 200mm CMP on all polishing applications
Dry-in and dry-out wafer processing (Trak and Mesa systems only)
Integrated OnTrak DSS Integra scrubber (Trak system only)
FABS unit can accommodate up to four 25-wafer cassettes
Polishing head optimizes uniformity across wafer by fine-tuning film removal rate to match specific slurry chemistries to control dishing and erosion

Specs and capabilities:

Automated system uses combination of chemistry and abrasion to remove specific amounts of material from wafer surfaces
Industry-leading 300mm CMP on all polishing applications
Can accommodate up to three load ports
Contour polishing head optimizes uniformity across wafer
Five independent pressure zones deliver unmatched within-wafer uniformity and edge control
Production-proven, high performance planarization for copper damascene, shallow trench isolation (STI), oxide, polysilicon, and tungsten applications
High-speed planarizing platens and multi-zone polishing for superior uniformity and efficiency
Low downforce for extendibility to < 45nm device generations
Integrated post-CMP Desica cleaner
Full-immersion Marangoni vapor drying technology virtually eliminates watermark defects and dramatically reduces particle contamination
Full suite of end-point methods, in-line metrology, and advanced process control capabilities
Excellent within-wafer and wafer-to-wafer process control and repeatability