Remanufactured Metrology Equipment

Entrepix offers remanufactured metrology equipment from Rudolph and CDE.

Rudolph Ellipsometer AutoEL II, III, and IV

Specs and capabilities:

  • Affordable and high performance

  • Accurately measures wide variety of films

  • Internal microprocessor automates system operation and reports delta and psi on front panel

  • Internal data reduction software automatically transforms delta and psi into thickness and refractive index

  • Optional data reduction software runs on PC and interfaces directly via standard RS232 serial pan

  • Users can retrieve previous sample parameters during future measurements with non-volatile memory (AutoEL III)

  • Speeds analyses of similar materials

  • Thermal printer provides hard copy of results (AutoEL III)

  • Three wavelength light source for selecting ideal wavelength for each sample (AutoEL IV)

  • Eliminates order ambiguities and other issues with measuring near full cycle thickness (AutoEL IV)

  • Built-in fail safe system automatically switches optical system to selected wavelength and makes required changes to data reduction software (AutoEL IV)

  • Master/slave microprocessor with expanded data reduction software (AutoEL IV)

Rudolph Focus Ellipsometers: FE III, FE IV, and FE VII

Specs and capabilities:

  • Accurate, repeatable results and precision film thickness measurements

  • Long life HeNe laser provides high signal to noise ratio for repeatability and wavelength accuracy of atomic transition

  • Technology uses NIST first principle measurement technique to calibrate thickness reference standards

  • Advanced Focused Beam™ system uses dual wavelength technology that measures with a small spot at multiple angles of incidence and wavelengths

  • Produces high certainty results on complex multi-layer films

  • Reliable and fast data across sub 30 Angstrom gates, thick polyimide, ILD on ARC, or small-spot multi-parameter processes

  • Optional second light source (FE III)

  • Calculation of up to six unknowns on complex multi-layer film stacks, such as OPO and ONO, for film thickness and composition (FE VII)

Features:

  • Advanced technology metrology system

  • Inherent accuracy for easy system matching

  • Dual wavelength for absolute order resolution

  • High throughput water transport up to 29 wafers per hour

  • Robust pattern recognition

  • Queued loading for simultaneous measurement, setup, and data review

  • Fast, accurate flat/notch wafer aligner

  • Powerful, easy-to-use software

  • GEM/SECS II compliant software

CDE ResMap Model 168

Specs and capabilities:

  • For production requirements under 300mm

  • Reliability, accuracy, and repeatability for thin film engineers

  • Auto cassette load

  • Lowers cost of ownership for thin film metrology for CMP, ion implant, diffusion process development, and monitoring

Get more info on remanufactured metrology equipment

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Refurbished Strasbaugh

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Refurbished OnTrak