CMP Carrier Head Film Replacement Testing - Semiconductor Digest

The choice of wafer carrier backing films for rigid back-plate wafer carriers can significantly influence the quality and yield of the final semiconductor product. With the discontinuation of the Pureon DF200 films we evaluated three possible replacement products and compared results across multiple factors including mean removal rate, mean induced range, mean WIWNU% as well as WTWRR%. See the full results here . Thank you to Semiconductor Digest for publishing this important study in their July 2024 edition.