Strasbaugh CMP Wafer Polishers
Entrepix works with three different models of Strasbaugh CMP equipment.
Strasbaugh 6DS-SP nTegrity
Specs and capabilities:
Fully automated precision polishing
Ideal for applications that require repeatability with operational and processing flexibility
Automatic wafer handling
Can polish two wafers on a single platen to maximise throughput capability and quantity
Removes materials to polish wafers and achieve flatness, uniformity, and planarization on blanket or patterned device wafers
Processing flexibility
Repeatable results
Wafer sizes of 100mm to 200mm
Strasbaugh 6EC nSpire
Specs and capabilities:
Economical CMP tool for research, failure analysis, and low volume production
Semi-automatic operations programmable through color touchscreen
Repeatable, accurate process control
One slurry pump standard, option for second
Small dimensions: 48” x 37” x 72”
Pad conditioning
Wafer sizes of 4 inch, 6 inch, or 8 inch
Strasbaugh 6EG nHance
Specs and capabilities:
Economical CMP tool for research, failure analysis, and low volume production
Semi-automatic operations programmable through color touchscreen
Repeatable, accurate process control
Can polish two wafers on a single platen to maximize throughput capability and quantity
Removes materials to polish wafers and achieve flatness, uniformity, and planarization on blanket or patterned device wafers
Processing flexibility
Repeatable results
Wafer size of 300mm
Get info on remanufactured Strasbaugh CMP equipment
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