Remanufactured Metrology Equipment
Entrepix offers remanufactured metrology equipment from Rudolph and CDE.
Rudolph Ellipsometer AutoEL II, III, and IV
Specs and capabilities:
Affordable and high performance
Accurately measures wide variety of films
Internal microprocessor automates system operation and reports delta and psi on front panel
Internal data reduction software automatically transforms delta and psi into thickness and refractive index
Optional data reduction software runs on PC and interfaces directly via standard RS232 serial pan
Users can retrieve previous sample parameters during future measurements with non-volatile memory (AutoEL III)
Speeds analyses of similar materials
Thermal printer provides hard copy of results (AutoEL III)
Three wavelength light source for selecting ideal wavelength for each sample (AutoEL IV)
Eliminates order ambiguities and other issues with measuring near full cycle thickness (AutoEL IV)
Built-in fail safe system automatically switches optical system to selected wavelength and makes required changes to data reduction software (AutoEL IV)
Master/slave microprocessor with expanded data reduction software (AutoEL IV)
Rudolph Focus Ellipsometers: FE III, FE IV, and FE VII
Specs and capabilities:
Accurate, repeatable results and precision film thickness measurements
Long life HeNe laser provides high signal to noise ratio for repeatability and wavelength accuracy of atomic transition
Technology uses NIST first principle measurement technique to calibrate thickness reference standards
Advanced Focused Beam™ system uses dual wavelength technology that measures with a small spot at multiple angles of incidence and wavelengths
Produces high certainty results on complex multi-layer films
Reliable and fast data across sub 30 Angstrom gates, thick polyimide, ILD on ARC, or small-spot multi-parameter processes
Optional second light source (FE III)
Calculation of up to six unknowns on complex multi-layer film stacks, such as OPO and ONO, for film thickness and composition (FE VII)
Features:
Advanced technology metrology system
Inherent accuracy for easy system matching
Dual wavelength for absolute order resolution
High throughput water transport up to 29 wafers per hour
Robust pattern recognition
Queued loading for simultaneous measurement, setup, and data review
Fast, accurate flat/notch wafer aligner
Powerful, easy-to-use software
GEM/SECS II compliant software
CDE ResMap Model 168
Specs and capabilities:
For production requirements under 300mm
Reliability, accuracy, and repeatability for thin film engineers
Auto cassette load
Lowers cost of ownership for thin film metrology for CMP, ion implant, diffusion process development, and monitoring
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