Customer Information




Wafer Information

Material(s) to be Polished

Bulk

Thin Film

Wafer Size

100mm

125mm

150mm

200mm

Other

Substrate

Silicon

Gas

Other

Flat

Notch

Process Metrics

Units

Incoming

Post-CMP Target

Film Thickness
(over highest point in the pattern)

Step Height

Surface Roughness (Ra)

Other (Specify)

Process Constraints (If any)

Device or application



Deposited film stack, preferred measurement location and
any other details