Your CMP Foundry: Contract Manufacturing and Research & Development

The Entrepix foundry can process your overflow production, provide process engineering solutions and demonstrate equipment performance prior to sales and installation.

Entrepix’ Foundry is home to a variety of wafer production services and R&D that we perform on behalf of our clients. We are here as an extension of your team to assist in device fabrication, volume production, research new processes well as demonstrate and qualify new materials, equipment and consumables.

Engineering and Technology Development for CMP

Entrepix has a knowledgeable team of engineers and technology experts to help clients in CMP, cleaning, and distributed process flows. We work with all wafer diameters from coupons to 200mm, and help our clients:

  • Rapidly advance technology

  • Study cost reduction

  • Integrate new materials

  • Develop process improvements

  • Screen consumables

  • Assess cost and productivity

  • Achieve flexibility in design and processing methods

Volume Production

We can help build and produce wafers to your needs and specifications for complete outsourcing and as overflow capacity. As a top 10 IDM, we’ve processed more than one million wafers and are ISO 9001:2015 certified.

We offer guaranteed cycle times and use quality systems like FMEAs, SPC, internal audits, and CARs.

In-House Processing Tool Sets

At Entrepix, we use the following processing tools to meet your success criteria:

Processing ToolsPlatforms
CMPAMAT Mirra: 150-200mm wafer processing
IPEC 472(2): Coupon-200mm
Post-CMP CleansOnTrak DSS-200 Synergy: 100-200mm
OnTrak DSS-200 Series 2: 100-200mm
SRD: 75-200mm

In-House Metrology Equipment

At Entrepix, we use the following metrology tools to ensure uniformity:

Metrology ToolsPlatforms
Dielectric Film ThicknessThermawave Optiprobe 2600DUV
Mikropack UV/Vis/NIR Reflectometer
Conductive Film ThicknessCDE ResMap 168 4-point probe
Substrate ThicknessFSM 413-300
Surface ProfilometerDektak D8 (with ultralow force and 3D mapping)
Tencor P2
Precision Analytical BalanceMettler-Toledo, A and D, Sartorius
Defect InspectionKLA-Tencor SP1 TBI (200mm)
AMAT Orbot WF-736DUO
Defect ReviewLeica optical review (built into AMAT platforms)
Optical MicroscopesNikon Optiphot
Zeiss Ergoplan (with Nomarski DIC)
Leica stereozoom
MiscellaneousVarious analytical and characterization equipment
Also Available (third party)SEM, AFM, TXRF, and other techniques (additional cost)

Materials We Polish

CMOS

  • Oxide

  • Tungsten

  • Copper

  • Barrier metals (Ta, Co, Ru)

  • Shallow trench

  • Polysilicon

  • Low k dielectrics

  • Capped ultra low k

  • Metal gates

  • Gate insulators

  • High k dielectrics

  • Ir and Pt electrodes

  • Refractory metals

  • Aluminum

Substrate/Epi

  • Si and SOI

  • GaAs and AIGaAs

  • InP and InGaP

  • Poly-AIN and GaN

  • CdTe and HGCdTe

  • Ge and SiGe

  • Lithium Niobate

  • Titanium

  • Quartz, glass, and silica

  • Sapphire

  • Diamond and DLC

  • SiC

New Applications

  • MEMS

  • Through Si Vias (TSV)

  • Direct wafer bond

  • 3D packaging

  • Ultra thin wafers

  • Polymers and resists

  • CNT and nanodevices

  • NiFe and NiFeCo

  • Al and stainless steel

  • Detector arrays

  • Magnetics

  • Photonics and solar

  • LED and optics

  • Power devices

  • Analog and RF

  • FINFET structures

 Certifications

 

Get Assistance with Research and Manufacturing

Need help with research or manufacturing? Contact us and we’ll reply to you shortly.